Project 1

• Conducted molecular dynamics (MD) simulations in LAMMPS to investigate the influence of grain boundary (GB) character, temperature, and tensile stress on the creep behavior of Ni, W, and Cu during nanoscale sintering.

• Quantified the activation volume and energy for creep as functions of temperature and tensile stress based on strain rate, providing insight into creep mechanisms and supporting the design of optimized nanoscale sintering processes.